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Regarding ceramic substrates, we can divide them into aluminum nitride ceramic substrates and alumina ceramic substrates according to their materials. Alumina Ceramic Substrates Al2O3 ceramic substrate has good overall performance, and is a commonly used material for ceramic substrates with mature applications and a wide range of applications. Al2O3 is rich in raw materials, low in price, high in strength, hardness, heat shock resistance, insulation, chemical stability, and good adhesion to metals. Increasing the content of Al2O3 in the substrate can improve its overall performance. Incorporating metal conductors such as Ag, Ag-Pd or low-melting glass into Al2O3 can reduce the sintering temperature and the dielectric constant. But the price of this is that the temperature required for sintering will also increase, and the manufacturing cost will increase accordingly. For a long time, Al2O3 has been the main substrate material used in packaging. However, compared to other substrates, the relatively low thermal conductivity of Al2O3 makes it difficult to meet the needs of future packaging. The industry needs a more advanced ceramic substrate with a higher heat dissipation coefficient. Alumina Nitride Ceramic Substrates Aluminum nitride is one of the few materials with good thermal conductivity and good electrical insulation properties. Aluminum nitride has a high thermal conductivity. The theoretical thermal conductivity can reach 320W/(m·K) at room temperature, which is 8-10 times that of alumina ceramics. The actual thermal conductivity can be as high as 200W/( m·K), which is conducive to the heat dissipation in the chip and improves the performance of the device; Aluminum nitride has a hexagonal crystal structure and is a covalent bonded material. The use of sintering aids and hot pressing is required to produce a dense technical grade material. The material is stable to very high temperatures in inert atmospheres. Aluminium nitride is resistant to metal erosion in the molten state and is almost not stabilized by acid. Because the surface of aluminium nitride is exposed to moist air will react to form a very thin oxide film, people use this property to use it as a crucible and firing mold material for the melting of metals such as aluminum, copper, silver, Welcome contact us. |